Current Jobs

I. Mission Responsible for the mechanical design and verification of key ECP modules (including reaction chambers, pre/post-treatment modules, EFEM/alignment & transfer, chemical supply/filtration/degassing, fixtures and test jigs), achieving optimal performance and cost while meeting reliability and manufacturability requirements.

II. Key Responsibilities

1. Requirements Decomposition: Based on product requirements/customer POR and reliability targets, complete mechanical solutions and interface definitions (including SEMI/safety specifications).

2. Detailed Design: 3D modeling and drafting, materials and tolerances, sealing/corrosion protection, fluid/structure design; collaborate with electrical and software teams to complete system interfaces.

3. Design Verification: Prototype assembly, functional/lifetime/environmental testing, structural strength and fluid/thermal analysis (ANSYS/COMSOL), problem identification and optimization (8D).

4. Manufacturability/Maintainability: DFM/DFS, assembly and maintenance tooling, standard component selection, BOM structure and ECN.

5. Reliability: MTBF/MTTR improvement, lightweighting/modularization.

6. CIP: Continuous improvement design for Alpha/Beta/SAT, problem reproduction and closure.

Requirements

1. Master's degree in mechanical engineering, mechanics or related fields; proficient in design software and tolerance stack-up, materials and surface treatment, sealing and corrosion protection.

2. Basic fluid/thermal/structural simulation capability; experience in engineering experiments and data analysis.

3. Strong cross-disciplinary collaboration and problem-closure skills; able to read technical documents in English.

4. Plus: Internship experience in semiconductor equipment, CFD/FEA projects, hands-on experience with IPD/NPI/ECN.

I. Mission Focusing on Electrochemical Plating and integrating with upstream/downstream processes, aim for high uniformity, high yield, and high stability. Conduct process development and material validation, and establish standardized methods (SPC/DOE/metrology).

II. Key Responsibilities

1. Process Development: Develop and optimize bath formulation windows (acidity, metal ions, Cl⁻, additives) and process parameters (current, pulse, temperature, flow rate, agitation).

2. Metric Achievement: Thickness uniformity, filling capability, roughness, stress, Rs/RC.

3. Characterization & Metrology: 2D/3D, CV/EIS, CVS, contact angle; manage outsourced testing and metrology method validation.

4. Experimental Design: DOE, SPC, regression/ANOVA, cause-effect analysis, stability evaluation.

5. Production Ramp-up: Alpha/Beta → SAT → high-volume manufacturing SOP/WI, CP/CPK, OCAP, FMEA/control plan.

6. CIP Continuous Improvement: Customer sample validation and problem closure.

Requirements

1. Master's degree in materials, chemistry, chemical engineering, microelectronics, or related fields.

2. Familiar with DOE/SPC/statistical analysis, metrology and characterization.

3. Plus: Experience with electroplating/RDL/bump/TSV filling projects; CVS/additive mechanisms; process-equipment co-optimization experience; wet chemistry/electrochemistry fundamentals and experimental skills.

I. Mission Design equipment electrical control and motion platforms (PLC/IPC/motion control/safety circuits), achieving high-availability and maintainable system electrical architecture and integration.

II. Key Responsibilities

1. Architecture Design: PLC, motion control, I/O, drives and sensors, power supply and grounding, communication buses (EtherCAT/Profinet/Modbus).

2. Schematic & Selection: Electrical schematics and component selection, cabinet layout and wiring, safety/EMC/grounding solutions, emergency stop and dual-channel safety circuits.

3. Software Interface: Define and integrate interfaces with host PC/algorithms/HMI/SEMI GEM/SECS.

4. Integration & Verification: Whole-tool I/O checkout, interlock testing, simulated/actual integration, fault injection and abnormal scenario verification.

5. Field Support: SAT/high-volume manufacturing problem diagnosis, revision and ECN.

Requirements

1. Master's degree in electrical engineering, automation, measurement & control or related fields; familiar with PLC/motion control, fieldbus, and electrical drafting.

2. Plus: Internship experience in semiconductor equipment, EtherCAT motion, functional safety, servo/stepper tuning, instrument (flow/pressure/pH/conductivity) integration experience.

I. Mission Develop equipment host PC/control layer software and scheduling algorithms to ensure reliable operation, good user experience, and external protocol connectivity.

II. Key Responsibilities

1. Architecture & Implementation: Host PC software (C#/WPF), control services (C#), drivers and communications.

2. Scheduling Algorithms: Design reliable, high-throughput job scheduling and exception recovery strategies for multi-chamber/multi-robot (EFEM/Process Robot) concurrent scheduling.

3. Protocols & Integration: Interface with SEMI GEM/SECS/E84/E37/E5 protocol stacks; MES/reporting/logging/tracing.

4. Quality & Delivery: Unit/integration/system testing, CI/CD, logging and observability, bug reproduction and fixing.

5. Integration & Field Support: Collaborate with electrical/process/mechanical teams; support Alpha/Beta/SAT.

Requirements

1. Bachelor's or Master's degree in computer science, automation, software engineering or related fields; proficient in at least one of C#, C++, or C.

2. Good engineering practices: version control, code review, testing, logging.

3. Plus: Internship experience in equipment control/industrial software; real-time scheduling, SEMI protocols, OPC UA, WPF MVVM, message queue/database experience.

I. Mission Technical hub connecting "R&D – Manufacturing – Field". Support Alpha/Beta/SAT and high-volume manufacturing, drive rapid problem closure and continuous product improvement (CIP/ECN).

II. Key Responsibilities

1. Owner of R&D tools, identify problems and collaborate with corresponding R&D and customer technical teams to close issues.

2. Lead Delivery: Standardize installation/commissioning (WI, checklists, online verification), SAT-A/B quality gates.

3. Problem Closure: Problem classification/dispatch, localization and reproduction, drive 8D/5Why, FMEA updates and ECN.

4. Data & Knowledge: Track E10/E95, MTBF/MTTR, first-time yield (FTY) and repair rate; build knowledge base and training materials (technical docs, user manuals).

5. Customer Interface: Technical communication at key milestones (POR, production ramp-up); coordinate R&D, manufacturing, supply chain, and customer teams. Effectively analyze internal/external customer requirements, assess feasibility and rationality.

6. Experiments & Validation: Plan and evaluate on-site/off-site experiments, re-analyze returned samples, logs, and data.

Requirements

1. Master's degree in mechanical, electrical, materials, chemical, chemistry, physics, optoelectronics, automation, naval architecture, energy, mechanics, or other STEM fields.

2. Strong communication, organizational skills, and ability to work under pressure.

3. Plus: Internship experience in semiconductor equipment or fab, project management (PMP/Agile), systems thinking, data analysis (Excel/SQL/Python – any one).

I. Mission

1. This role faces customers directly and deeply influences their perception of our brand. Therefore, selecting key talent and investing critical resources to train this role will be key to determining our brand positioning at customer sites.

2. Responsible on-site for equipment installation, commissioning, maintenance, troubleshooting, and upgrades, ensuring high availability, stable operation, and customer satisfaction.

II. Key Responsibilities

1. Troubleshooting (advanced capability): 1.1. Triage and response 1.2. Systematic diagnosis: Follow "phenomenon → boundary → reproduce → root cause → verify" process; use methods such as 5-Why, fishbone diagram, fault tree analysis (FTA), parameter comparison, and log replay. 1.3. Multi-disciplinary collaboration: Work with process/TPS/R&D teams to conduct joint software/hardware/chemistry diagnostics; escalate to remote expert meetings and second-tier support as needed. 1.4. Repair & verification: Perform replacement/adjustment/upgrade, output verification cases (function/reliability/safety), ensure first-time fix rate (FTFR). 1.5. Recurrence prevention: Generate 8D reports, submit ECN/software patches/maintenance strategy adjustments, update OCAP/checklists; maintain knowledge base (KCS).

2. Installation & Commissioning: Incoming inspection, positioning, utility/electrical connection, I/O checkout, interlock testing, SAT support and sign-off.

3. Preventive Maintenance & Upgrades: Execute and optimize PM/checklists; firmware/software/parameter upgrades; manage critical spare part health and lifetime.

4. Data & Communication: Collect and analyze uptime/downtime/alarm data; weekly/monthly reports; customer training and operation standard guidance; enforce EHS and 5S.

Requirements

1. Bachelor's or Master's degree in mechanical, electrical, automation, measurement & control, materials, or related engineering fields.

2. Required skills: Read drawings (mechanical/electrical schematics, P&ID), use multimeter/oscilloscope/pressure & flow meters/temperature & conductivity meters, basic PLC/HMI operation and log export, basic chemistry and EHS knowledge, replace and calibrate structural/motion components, clear documentation and reporting.

3. Methodologies: 5-Why, fishbone, 8D, FMEA/OCAP, KCS/FRACAS.

4. Soft skills: Work under pressure and emergency response, customer communication and expectation management, cross-team collaboration.

5. Plus: Internship experience in semiconductor equipment or fab.

I. Mission

1. This role faces customers directly and deeply influences their perception of our brand. Therefore, selecting key talent and investing critical resources to train this role will be key to determining our brand positioning at customer sites.

2. Drive process introduction, recipe tuning, and yield improvement on customer production lines, ensuring process meets POR/CPK targets and achieves stable high-volume manufacturing.

II. Key Responsibilities

1. Troubleshooting 1.1. Triage and SLA 1.2. Process diagnosis: Based on SPC charts/lot genealogy/RS maps/cross-sections/defect maps/bath history, follow the "quick judgment → boundary → reproduce → root cause → verify" closure loop; tools: 5-Why, fishbone, DOE (including EVOP/screening experiments), MSA, regression/ANOVA. 1.3. Joint localization: Collaborate with FSE (hardware/motion/interlocks), TPS (issue management/ECN), process/equipment R&D, and chemical/filtration consumable suppliers to locate and repair. 1.4. Repair & verification: Recipe/parameter/adjustments/addition/filtration/regeneration/bath change, hardware co-check (anode contact/fluid distribution/alignment), software/recipe version rollback or upgrade; execute golden lot verification and regression. 1.5. Recurrence prevention: Output 8D, OCAP, control plan; update checklists/SPC rules/sampling plans; drive ECN or software patches.

2. Production Maintenance & Optimization: Maintain POR window and guardband; manage additives (CVS/titration/addition curves); optimize filtration/degassing/top-off cycles; bath lifetime and cost optimization.

3. Introduction & Ramp-up: Sample → small batch → production ramp-up; recipe version management, metrology methodology validation, weekly yield ramp-up reports and reviews.

4. Data & Knowledge: Dashboard for site KPIs (CPK, scrap rate, first-pass yield, downtime density); KCS knowledge base; standardize SOP/OCAP and training.

Requirements

1. Bachelor's or Master's degree in materials, chemistry, chemical engineering, microelectronics, physics, or related fields.

2. Good communication and ability to work under pressure.

3. Plus: Electrochemistry/wet chemistry fundamentals; electroplating/packaging/RDL/bump project experience; CVS/additive mechanisms; experience with cross-section/stress/roughness/resistance network metrology; ability to write OCAP/SOP; SPC/DOE/statistical analysis (JMP/Minitab/Python – any one); ability to read P&ID and basic instrument data.

Job Responsibilities

1. Break down material requirements based on company sales or production plans, calculate procurement needs via MRP, raise purchase requisitions, and hand over to the purchasing department.

2. Track materials, coordinate with purchasing department to confirm delivery dates according to production and R&D progress, ensure materials are delivered as required, and provide timely alerts.

3. Review ECR/ECN from the planning perspective and communicate relevant information to the sourcing department.

4. Create outsourced orders and track the progress of outsourced materials.

5. Generate various operational reports for the SCM department to provide effective monitoring and truthful feedback on the department's overall work.

6. Operate ERP system modules related to planning.

7. Approve and perform ERP operations for ad-hoc material requisitions from various departments.

8. Interface with production and R&D departments to support system operations for material requisition and return.

9. Monitor safety stock levels of high-volume materials, develop procurement plans based on production and R&D needs, raise purchase requisitions to ensure stable supply of batch materials.

10. Other tasks assigned by the company.

Requirements

1. Full-time college degree or above; management major preferred.

2. 3+ years of PMC experience in equipment manufacturing; semiconductor equipment industry experience preferred.

3. Sensitive to numbers, proficient in Kingdee ERP and SAP systems.

4. Align with company values, outgoing personality, strong logical thinking, good team player, able to work under pressure.

5. Proficient in various office software, especially Excel at an advanced level.

Job Responsibilities

1. Supplier Development & Management: Based on equipment R&D and production needs, identify, evaluate, and develop new non-standard part suppliers (e.g., machining, electroplating, fixtures); establish and maintain a reliable supplier pool.

2. Technical Communication & Requirement Translation: Work closely with R&D and engineering teams to accurately understand technical drawings and process requirements (e.g., machining, surface treatment) for non-standard parts; clearly communicate these to suppliers to ensure their production capability matches requirements.

3. Project Procurement Execution: Responsible for sample procurement, RFQ during pre-project phase, and material procurement during mass production, ensuring procurement progress meets project timelines.

4. Quality & Cost Control: Ensure quality of non-standard parts from suppliers; handle defective returns; conduct commercial negotiations to optimize procurement costs and control budgets.

5. Process & Systems: Familiar with ERP systems for procurement process management; understand requirements of quality management systems like IATF 16919 on procurement; handle relevant documentation.

Requirements

1. Education: Bachelor's degree or above in mechanical engineering, materials, electronics, precision instrumentation, supply chain management, or related STEM fields.

2. Experience: Typically 3+ years of procurement or supply chain experience; experience in semiconductor equipment, photovoltaics, new energy, or automotive manufacturing preferred; especially familiar with electroplating, machining, etc.

3. Core Skills:

   • Able to read mechanical drawings, understand basic machining and electroplating processes.

   • Proficient in MS Office and ERP systems.

   • Good English communication skills (written and spoken) to handle communications with international suppliers.

   • Strong negotiation, problem-solving, and sense of responsibility.

4. Other: Willing to travel frequently for projects or supplier audits.

Job Responsibilities

1. Production Planning & Organization: Based on company production plans, allocate manpower, equipment, and materials reasonably to ensure output targets and delivery lead times for electroplating processes.

2. Process & Quality Management: Monitor electroplating production processes, analyze and resolve yield issues (e.g., non-uniform coating, poor adhesion); collaborate with technical and quality departments for process improvement and quality enhancement.

3. Equipment Maintenance & Management: Responsible for daily maintenance, upkeep, and troubleshooting of electroplating tools; ensure equipment is in good operating condition; develop and execute equipment maintenance plans.

4. Cost & Efficiency Control: Monitor consumption of chemicals and raw materials; promote energy saving, consumption reduction, and lean production (e.g., 5S); continuously reduce manufacturing costs.

5. Team Building & Management: Responsible for recruitment, training, performance evaluation, and daily management of electroplating department employees; enhance team professional skills and safety awareness.

6. Safety & Compliance: Strictly enforce laws and regulations on safety, environmental protection, and occupational health; manage hazardous chemicals; ensure a safe production environment; achieve zero-accident target.

7. Cross-functional Collaboration: Work closely with R&D, quality, and supply chain departments; participate in new product introduction (NPI) and process innovation.

8. Operations Analysis: Analyze production data and market supply conditions; prepare departmental budgets and operational reports to support management decision-making.

Requirements

1. Education: Bachelor's degree or above; STEM majors (e.g., materials science, chemistry, electronic engineering, mechanical engineering) preferred.

2. Experience: Typically 5+ years of production management experience in semiconductor, electronics manufacturing, or related industries; experience with electroplating processes preferred.

3. Core Competencies:

   • Familiar with semiconductor manufacturing processes and electroplating technology principles.

   • Excellent production management, team leadership, and communication/coordination skills.

   • Ability to independently analyze and solve complex production problems.

   • Proficient in office software with data analysis capability.

   • Strong cost awareness and continuous improvement mindset.

Job Responsibilities

1. Customer Relationship Management & Business Interface

• Serve as the primary customer interface, responsible for managing customer visits, testing requests, technical communication, commercial negotiations, etc.

• Continuously track customer line expansion plans and advanced packaging roadmaps (e.g., Cu bump, Ni, SnAg, Au electroplating).

• Manage key decision chains including process teams, procurement, equipment engineering, manufacturing technology, CAPEX managers.

• Coordinate demos, trial production, tool testing (blanket/pattern), DoE plans, and result reporting.

2. Product Solutions & Technical Proposal Development

• Deeply understand customer requirements (process window, plating thickness uniformity, CPK, FTY, E10/E95, UPH, etc.).

• Work with internal process/mechanical/electrical/software teams to develop total electroplating equipment solutions:

  • Module configuration (number of chambers, Cu/Ni/SnAg/Au types)

  • EFEM/Robot/Scheduling metrics

  • Chemical recirculation system design (flow rate, filtration, additive control)

  • Throughput and cost model evaluation

• Output technical proposals and commercial/technical documents (T&Cs, SOW, BOM configuration).

3. Market Development & Competitive Intelligence

• Map out target region/customer packaging roadmaps: Fan-out, Flip-chip, TSV, Cu Pillar, 2.5D/3D HBM.

• Gather competitor intelligence (Lam Sabre, AMAT Raider, TEL, Gaoce, ACM, local Chinese players):

  • Technical strengths and gaps

  • Customer usage, failure points, field pain points

  • Pricing and commercial strategies

• Develop differentiated competitive strategies and sales approaches (e.g., reliability, service, TCO, process advantages).

4. Project Management

• Lead the entire process from requirements → quotation → demo → PO → shipment → installation acceptance.

• Lead regular project meetings (internal/customer weekly meetings) to ensure risk identification and closure.

• Coordinate cross-functional resources: process, systems, manufacturing, supply chain, after-sales service (TPS/FSE/FPE).

5. Commercial Quotation & Contract Management

• Lead quotation configuration: chamber configuration, chemical system, optional modules, spare parts, service agreements.

• Prepare CAPEX budget quotations in line with customer standards.

• Participate in negotiating contract terms (delivery, acceptance, warranty, payment terms, penalty).

6. Marketing Materials & Brand Promotion

• Collaborate with marketing lead to produce technical white papers, customer success stories, roadshow materials.

• Participate in exhibitions (Semicon China/Taiwan/Korea), seminars, customer technology days.

Requirements

1. Education

• Bachelor's degree or above; engineering majors preferred: materials, chemical engineering, mechanical, electrical, microelectronics, physics, etc.

• Semiconductor equipment background preferred: electroplating, wet process, CVD/ALD/ECD, CMP, etch all acceptable.

2. Experience

• 2–5 years of experience:

  • Semiconductor equipment sales or marketing experience

  • Fab client engineer (CE) experience

• Any of the following is a plus:

  • Experience delivering equipment to OSATs, IDMs, foundries

  • Sales of electroplating (Cu/Ni/SnAg/Au), wet etching, cleaning, CMP, or deposition equipment

  • Managing customer projects or large CAPEX equipment procurement processes

3. Skills

• Plus: Familiar with basic electroplating process mechanisms (additives, flow field, anode, uniformity, CVS control, etc.).

• Plus: Understanding of equipment architecture: chambers, fluid lines, robot, EFEM, scheduler, etc.

• Strong communication, commercial negotiation, and presentation skills (PPT technical proposals).

• Project management capability, able to coordinate across departments and resolve conflicts.

• English for email communication and reading technical documents (overseas customer interaction a plus).

4. Traits

• Highly customer-oriented.

• Strong sense of responsibility, goal-driven, able to work under pressure and drive rapid project closure.

• Willing to travel.