I. Mission

1. This role faces customers directly and deeply influences their perception of our brand. Therefore, selecting key talent and investing critical resources to train this role will be key to determining our brand positioning at customer sites.

2. Drive process introduction, recipe tuning, and yield improvement on customer production lines, ensuring process meets POR/CPK targets and achieves stable high-volume manufacturing.

II. Key Responsibilities

1. Troubleshooting
   1.1. Triage and SLA
   1.2. Process diagnosis: Based on SPC charts/lot genealogy/RS maps/cross-sections/defect maps/bath history, follow the “quick judgment → boundary → reproduce → root cause → verify” closure loop; tools: 5-Why, fishbone, DOE (including EVOP/screening experiments), MSA, regression/ANOVA.
   1.3. Joint localization: Collaborate with FSE (hardware/motion/interlocks), TPS (issue management/ECN), process/equipment R&D, and chemical/filtration consumable suppliers to locate and repair.
   1.4. Repair & verification: Recipe/parameter/adjustments/addition/filtration/regeneration/bath change, hardware co-check (anode contact/fluid distribution/alignment), software/recipe version rollback or upgrade; execute golden lot verification and regression.
   1.5. Recurrence prevention: Output 8D, OCAP, control plan; update checklists/SPC rules/sampling plans; drive ECN or software patches.

2. Production Maintenance & Optimization: Maintain POR window and guardband; manage additives (CVS/titration/addition curves); optimize filtration/degassing/top-off cycles; bath lifetime and cost optimization.

3. Introduction & Ramp-up: Sample → small batch → production ramp-up; recipe version management, metrology methodology validation, weekly yield ramp-up reports and reviews.

4. Data & Knowledge: Dashboard for site KPIs (CPK, scrap rate, first-pass yield, downtime density); KCS knowledge base; standardize SOP/OCAP and training.

Requirements

1. Bachelor’s or Master’s degree in materials, chemistry, chemical engineering, microelectronics, physics, or related fields.

2. Good communication and ability to work under pressure.

3. Plus: Electrochemistry/wet chemistry fundamentals; electroplating/packaging/RDL/bump project experience; CVS/additive mechanisms; experience with cross-section/stress/roughness/resistance network metrology; ability to write OCAP/SOP; SPC/DOE/statistical analysis (JMP/Minitab/Python – any one); ability to read P&ID and basic instrument data.