On May 18, Genius Way successfully delivered its first 12-inch horizontal electroplating system, Explora3D, to a leading semiconductor customer. As a key piece of equipment for advanced packaging, power devices, and compound semiconductor manufacturing, Explora3D supports a full range of mainstream electroplating applications, including TSV, Pillar, Bump, and RDL, enabling higher-density integration, device miniaturization, and enhanced chip performance.
Explora3D is compatible with 8-inch to 12-inch wafers and supports a wide variety of electroplating processes, including Cu, Ni, Au, SnAg, NiFe plating. The system features a highly flexible hardware architecture, accommodating up to three wafer load ports, four cleaning and drying modules, four pre-treatment modules, and as many as 16 electroplating chambers, allowing customers to configure the platform according to production requirements.
The system delivers outstanding process performance, achieving within-wafer uniformity of less than 5%, wafer-to-wafer uniformity of less than 3%, and process repeatability of less than 3%, meeting the stringent requirements of high-volume manufacturing for advanced semiconductor production.
Genius Way has long been dedicated to the development of semiconductor electroplating equipment, with a strong focus on electroplating technologies for advanced packaging applications. Committed to becoming a global provider of high-end semiconductor equipment and integrated process solutions, the successful shipment of Explora3D represents not only a significant milestone in the company’s development, but also a strong validation of its technological capabilities and volume production delivery capacity.
Looking ahead, Genius Way will continue to drive technological innovation, further optimize product performance and process solutions, and work closely with partners across the semiconductor value chain to accelerate the localization and advancement of China’s semiconductor equipment industry.
