On January 11, Genius Way successfully delivered its first self-developed Electrochemical Deposition (ECD) system, Explora3D, to a customer. The system integrates proprietary technologies, including a highly uniform electric field and flow field design, multi-chamber parallel processing, and continuous wafer transfer. These innovations enable industry-leading plating uniformity, with its overall capabilities earning strong recognition from the customer. Following installation and production deployment, Explora3D will help enhance the customer’s advanced packaging manufacturing efficiency and yield while providing reliable support for long-term, stable production line operation.
Looking ahead, Genius Way will continue to focus on the development of high-end semiconductor equipment, advancing technological innovation in line with industry needs and delivering higher-value equipment solutions to support the continued growth and technological independence of China’s semiconductor industry.
