I. Mission
Responsible for the mechanical design and verification of key ECP modules (including reaction chambers, pre/post-treatment modules, EFEM/alignment & transfer, chemical supply/filtration/degassing, fixtures and test jigs), achieving optimal performance and cost while meeting reliability and manufacturability requirements.

II. Key Responsibilities

1. Requirements Decomposition: Based on product requirements/customer POR and reliability targets, complete mechanical solutions and interface definitions (including SEMI/safety specifications).

2. Detailed Design: 3D modeling and drafting, materials and tolerances, sealing/corrosion protection, fluid/structure design; collaborate with electrical and software teams to complete system interfaces.

3. Design Verification: Prototype assembly, functional/lifetime/environmental testing, structural strength and fluid/thermal analysis (ANSYS/COMSOL), problem identification and optimization (8D).

4. Manufacturability/Maintainability: DFM/DFS, assembly and maintenance tooling, standard component selection, BOM structure and ECN.

5. Reliability: MTBF/MTTR improvement, lightweighting/modularization.

6. CIP: Continuous improvement design for Alpha/Beta/SAT, problem reproduction and closure.

Requirements

1. Master’s degree in mechanical engineering, mechanics or related fields; proficient in design software and tolerance stack-up, materials and surface treatment, sealing and corrosion protection.

2. Basic fluid/thermal/structural simulation capability; experience in engineering experiments and data analysis.

3. Strong cross-disciplinary collaboration and problem-closure skills; able to read technical documents in English.

4. Plus: Internship experience in semiconductor equipment, CFD/FEA projects, hands-on experience with IPD/NPI/ECN.