I. Mission
Focusing on Electrochemical Plating and integrating with upstream/downstream processes, aim for high uniformity, high yield, and high stability. Conduct process development and material validation, and establish standardized methods (SPC/DOE/metrology).

II. Key Responsibilities

1. Process Development: Develop and optimize bath formulation windows (acidity, metal ions, Cl⁻, additives) and process parameters (current, pulse, temperature, flow rate, agitation).

2. Metric Achievement: Thickness uniformity, filling capability, roughness, stress, Rs/RC.

3. Characterization & Metrology: 2D/3D, CV/EIS, CVS, contact angle; manage outsourced testing and metrology method validation.

4. Experimental Design: DOE, SPC, regression/ANOVA, cause-effect analysis, stability evaluation.

5. Production Ramp-up: Alpha/Beta → SAT → high-volume manufacturing SOP/WI, CP/CPK, OCAP, FMEA/control plan.

6. CIP Continuous Improvement: Customer sample validation and problem closure.

Requirements

1. Master’s degree in materials, chemistry, chemical engineering, microelectronics, or related fields.

2. Familiar with DOE/SPC/statistical analysis, metrology and characterization.

3. Plus: Experience with electroplating/RDL/bump/TSV filling projects; CVS/additive mechanisms; process-equipment co-optimization experience; wet chemistry/electrochemistry fundamentals and experimental skills.