Job Responsibilities

1. Customer Relationship Management & Business Interface

• Serve as the primary customer interface, responsible for managing customer visits, testing requests, technical communication, commercial negotiations, etc.

• Continuously track customer line expansion plans and advanced packaging roadmaps (e.g., Cu bump, Ni, SnAg, Au electroplating).

• Manage key decision chains including process teams, procurement, equipment engineering, manufacturing technology, CAPEX managers.

• Coordinate demos, trial production, tool testing (blanket/pattern), DoE plans, and result reporting.

2. Product Solutions & Technical Proposal Development

• Deeply understand customer requirements (process window, plating thickness uniformity, CPK, FTY, E10/E95, UPH, etc.).

• Work with internal process/mechanical/electrical/software teams to develop total electroplating equipment solutions:

  • Module configuration (number of chambers, Cu/Ni/SnAg/Au types)

  • EFEM/Robot/Scheduling metrics

  • Chemical recirculation system design (flow rate, filtration, additive control)

  • Throughput and cost model evaluation

• Output technical proposals and commercial/technical documents (T&Cs, SOW, BOM configuration).

3. Market Development & Competitive Intelligence

• Map out target region/customer packaging roadmaps: Fan-out, Flip-chip, TSV, Cu Pillar, 2.5D/3D HBM.

• Gather competitor intelligence (Lam Sabre, AMAT Raider, TEL, Gaoce, ACM, local Chinese players):

  • Technical strengths and gaps

  • Customer usage, failure points, field pain points

  • Pricing and commercial strategies

• Develop differentiated competitive strategies and sales approaches (e.g., reliability, service, TCO, process advantages).

4. Project Management

• Lead the entire process from requirements → quotation → demo → PO → shipment → installation acceptance.

• Lead regular project meetings (internal/customer weekly meetings) to ensure risk identification and closure.

• Coordinate cross-functional resources: process, systems, manufacturing, supply chain, after-sales service (TPS/FSE/FPE).

5. Commercial Quotation & Contract Management

• Lead quotation configuration: chamber configuration, chemical system, optional modules, spare parts, service agreements.

• Prepare CAPEX budget quotations in line with customer standards.

• Participate in negotiating contract terms (delivery, acceptance, warranty, payment terms, penalty).

6. Marketing Materials & Brand Promotion

• Collaborate with marketing lead to produce technical white papers, customer success stories, roadshow materials.

• Participate in exhibitions (Semicon China/Taiwan/Korea), seminars, customer technology days.

Requirements

1. Education

• Bachelor’s degree or above; engineering majors preferred: materials, chemical engineering, mechanical, electrical, microelectronics, physics, etc.

• Semiconductor equipment background preferred: electroplating, wet process, CVD/ALD/ECD, CMP, etch all acceptable.

2. Experience

• 2–5 years of experience:

  • Semiconductor equipment sales or marketing experience

  • Fab client engineer (CE) experience

• Any of the following is a plus:

  • Experience delivering equipment to OSATs, IDMs, foundries

  • Sales of electroplating (Cu/Ni/SnAg/Au), wet etching, cleaning, CMP, or deposition equipment

  • Managing customer projects or large CAPEX equipment procurement processes

3. Skills

• Plus: Familiar with basic electroplating process mechanisms (additives, flow field, anode, uniformity, CVS control, etc.).

• Plus: Understanding of equipment architecture: chambers, fluid lines, robot, EFEM, scheduler, etc.

• Strong communication, commercial negotiation, and presentation skills (PPT technical proposals).

• Project management capability, able to coordinate across departments and resolve conflicts.

• English for email communication and reading technical documents (overseas customer interaction a plus).

4. Traits

• Highly customer-oriented.

• Strong sense of responsibility, goal-driven, able to work under pressure and drive rapid project closure.

• Willing to travel.